By Joe Kelly
That includes beneficial enter from industry-leading businesses and highly-regarded specialists within the box, this first-of-its type source bargains skilled engineers a entire realizing of the complex themes in RF, SiP (system-in-package), and SoC (system-on-a-chip) creation checking out which are serious to their paintings concerning semiconductor units. The e-book covers key dimension strategies for semiconductor gadget trying out and assists engineers in explaining those strategies to administration to help reduce undertaking price, time, and assets. according to real-world event and choked with time-saving equations, this in-depth quantity deals execs useful info on crucial subject matters that experience by no means been awarded in one reference prior to.
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Extra info for Advanced Production Testing of RF, SoC, and SiP Devices
9, 1994, pp. 94–105. , “Techniques Optimize Calibration of PCB Fixtures and Probes,” Microwaves & RF, Vol. 34, No. 11, 1995, pp. 93–98. , “Error Models for Systems Measurement,” Microwave Journal, Vol. 22, No. 5, 1978, pp. 63–66. Concepts of Production Testing of RF, SoC, and SiP Devices 19  Agilent Technologies, “Ultra Wideband Communication RF Measurements,” Application Note 1488, 2004.  Agilent Technologies, “WIMAX Concepts and Measurements,” Application Note, 2004. ” Application Note, 2004.
The remaining 63% is dissipated as heat. Because the power amplifier is the device that has the highest current consumption in a mobile phone, for instance, systems and design engineers pay a lot of attention to PAE because this Tests and Measurements I: Fundamental RF Measurements 33 is the main factor that causes the battery to drain and therefore reduces a mobile phone’s usable time before it has to be recharged. References  Agilent Technologies, “S-Parameter Design,” Application Note 154, 2000.
After verifying that this setting indeed generates an RF tone at the expected frequency, the divider is reprogrammed by flipping all bits and the RF tone is measured again 26 Advanced Production Testing of RF, SoC, and SiP Devices at a different frequency. For instance, the divider might first be programmed to the value 011111111111, which corresponds to the divider setting 2047 and generates a frequency f1. Next, the divider is reprogrammed to the value 2048 (binary number 1000000000), which generates a frequency at f2.
Advanced Production Testing of RF, SoC, and SiP Devices by Joe Kelly